Hybrid bonding is becoming the preferred approach to making heterogeneous integration work, as the semiconductor industry shifts its focus from 2D scaling to 3D scaling. By stacking chiplets ...

SINGAPORE, Nov. 13, 2024 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa", "K&S", "we" or the "Company"), in collaboration with ...

A new type of 3D-printed adhesive could change how we join materials together. So far, scientists have developed two new methods that can create extremely strong bonds at the pore level, eliminating ...

Molecular assembly is a fundamental concept in nanotechnology that involves the controlled arrangement of molecules or molecular components into ordered structures with desired properties and ...