The U.S. heterogeneous integration market is estimated at USD 0.47 billion in 2025E and is projected to grow at a CAGR of 22.99% from 2026 to 2033, reaching USD 2.47 billion. Growth is driven by ...

The rapid evolution of heterogeneous integration and packaging technologies is reshaping the landscape of electronic design by enabling the assembly of diverse, specialised chip components into ...

Digital lithography technology (DLT) is promising chipmakers to combine chips with submicron wiring on glass and other large substrates. And this maskless technology is at the center of a strategic ...

Experts at the Table: Semiconductor Engineering sat down to discuss problems and potential solutions in heterogeneous integration with Dick Otte, president and CEO of Promex Industries; Mike Kelly, ...

TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703) has successfully developed Tiling crystal film bonding (CFB; Note 1) technology using its proprietary CFB technology. This technology makes possible the ...

The group is also building an OSAT facility. This is in view of a larger plan to create a hub for chiplet integration and ...

The Defense Advanced Research Projects Agency (DARPA) is helping to foster the next wave of microelectronics, the development and manufacturing of so-called three-dimensional heterogeneous integration ...

Review these critical steps for choosing microelectronics and learn how a manufacturer can help integrate them into your next ...

Are you feeling nostalgic for homogeneous integration of chips – one flat board where you can use your fingers to stuff in all the circuitry you need? Best to head to the Lego store or Russia. The ...

Heterogeneous computing systems integrate diverse processing elements—including central processing units (CPUs), graphics processing units (GPUs) and field-programmable gate arrays (FPGAs)—within a ...

Recently, a research team led by Academician Lijun Wang at CIOMP under UCAS has systematically reviewed the latest advancements in transfer printing (TP) technology. The team detailed its practical ...

Tyndall National Institute, Cork, Ireland is leading a European consortium, called TOP-HIT, to develop novel technology that will address the challenge of integrating components of different materials ...