OKI (TOKYO: 6703) has successfully developed Tiling crystal film bonding (CFB; Note 1) technology using its proprietary CFB technology. This technology makes possible the heterogeneous integration of ...

-Aiming for mass production in FY2026 for real-world implementation in the fields of 6G communications and non-destructive sensing- TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703) , in collaboration with ...

Engineered-diamond thermal platform designed for integration into advanced packaging workflows and heterogeneous ...

In a press release, Applied Materials announced it had acquired a 9% stake in Dutch semiconductor assembly equipment maker BE Semiconductor Industries, marking a deeper commitment to their four-year ...

A new technical paper titled “Heterogeneously integrated lithium tantalate-on-silicon nitride modulators for high-speed communications” was published by researchers at EPFL, Chinese Academy of ...

With the rapid expansion of artificial intelligence (AI), high-performance computing (HPC), and data center applications, the demand for high-speed chip-to-chip interconnects has intensified, driving ...

In today's fast-changing technological landscape, two key theories determine the future of semiconductor design: Moore's Law and the More-than-Moore approach. While Moore's Law focuses on increasing ...

- Contributing to the advancement of photonics-electronics convergence technology and working with partners for early commercialization - TOKYO--(BUSINESS WIRE)-- OKI (TOKYO: 6703) has successfully ...