3-cyanopropyltrimethoxysilane (CN-TMOS) molecules anchoring at the buried interface between the perovskite layer and the hole transport layer. The CN-TMOS strengthens interfacial adhesion, reduces ...
Using atomic-scale defects in diamond, researchers in China have gained unprecedented insights into the complex chemical processes that unfold at the interfaces between solid surfaces and their ...
Variation is becoming a bigger problem in multi-die assemblies with TSVs and hybrid bonding. Multi-modal approaches are required to test these devices. AI plays a role in improving defect capture rate ...
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