Chip designs are busting out beyond the reticle limits of lithography machines, making chiplets and high-bandwidth, in-package die-to-die interconnects inevitable. And AI training workloads are ...
Belden Inc. has redesigned its Layer 3 modular Gigabit switch to create a new version, the MSP30-X Modular Switch, which is suited for extreme environments. The switch not only maintains its modular ...
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