The term "multiphysics" applied to FEA software refers to the simultaneous combination of multiple physical models from different domains — such as fluid, structure, and chemical — to accurately ...

COMSOL version 6.0 delivers performance improvements and simplifies simulation of many important applications, such as printed circuit board (PCB) design (pictured). COMSOL Inc. (Burlington, Mass., ...

BURLINGTON, Mass., Nov. 18, 2025 (GLOBE NEWSWIRE) -- COMSOL, a global leader in modeling and simulation software, today announced the release of COMSOL Multiphysics ® version 6.4, which introduces new ...

Ansys has collaborated with TSMC to ease the simulation and modeling of EM interactions on wireless ICs manufactured by TSMC. The Ansys multiphysics simulation platform works with TSMC’s N6RF Design ...

Hyperscale datacenters are redefining the limits of data transmission technology, driven by increasing demands for higher bandwidth, lower power consumption, and reduced latency. Through advanced ...

COMSOL, the leading provider of software solutions for multiphysics modelling and simulation, today made available the latest release of the COMSOL Multiphysics and COMSOL Server products. Version ...

The stress-from-heat problem involves a tube in a ceramic block. One surface of the block is uniformly heated. A first step of this sequential multiphysics analysis solves for the velocity profile.

Simulating physics is central to robotics: before a robot ever moves in the real world, much of its learning, testing, and control happens in a virtual environment. But traditional simulators often ...