The U.S. Department of Commerce today announced the launch of a new federal funding competition that aims to spur the research and development of more advanced computer chip packaging technologies.

Apple Inc. today announced that it will become the first and largest customer of a $2 billion chip packaging facility Amkor Technology Inc. is building in Arizona. The facility will process chips that ...

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...

The proposed funding, part of the CHIPS Act, is intended to stoke chip packaging, a process that helps drive progress in semiconductors but that takes place mostly in Asia. By Don Clark Reporting from ...

FTDI Chip is a long-established company providing silicon solutions to “bridge technologies” for mobile devices and consumer electronics, best known for its USB chips used in such embedded development ...