The semiconductor manufacturing process involves many steps, including, but not limited to, film deposition, photolithography, etching, and chemical mechanical polishing (CMP). Contamination can ...
As semiconductor devices become more complex and the critical particle size for today’s cutting-edge technology nodes falls into the sub-10 nm size range, controlling and mitigating potentially ...
Producing high-purity wafers via the CMP process is a critical application and the halting of harmful slurry-DIW ...
At the 2025 PDF Solutions Users Conference, CEO John Kibarian delivered a wide-ranging keynote that positioned the ...
Plasma resistant coatings are advanced protective layers engineered to withstand the aggressive conditions encountered in plasma processing, especially within semiconductor manufacturing. These ...
Fastmicro B.V. is a manufacturer of surface particle defect detection systems and equipment established over 15 years ago. The main product lines include sample surface particle defect scanning, ...
Semiconductor manufacturing: Next-generation polyamide sheet shortens processing time and cuts costs
This company has developed a negative photo-definable polyimide sheet for glass-core substrates in used to connect chips to ...
Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...
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