With advancement in technology, processors and other high-speed digital components such as CPUs, GPUs, ASICs, and FPGAs demand increasingly higher power, which means voltage regulators need to be able ...

The next big leap in CPU design won’t come from adding more cores, chasing smaller nodes, or stacking additional chiplets onto one CPU. That's not to say that things like AMD's 3D V-Cache aren't good, ...

As artificial intelligence (AI) workloads grow larger and more complex, the various processing elements being developed to process all that data are demanding unprecedented levels of power. But ...

Backside power delivery is being called a game changer — a breakthrough technology and the next great enabler in CMOS scaling. It promises significant PPA advances, including faster switching, lower ...

The AI boom is driving up the power demands of CPUs, GPUs, and other high-performance SoCs in data centers—and they show no signs of slowing down. Today, the most advanced AI chips are bordered on ...

SANTA CLARA, Calif., May 01, 2025 (GLOBE NEWSWIRE) -- Movellus today announced the industry’s first on-chip sensor for power delivery network (PDN) characterization and monitoring. Power integrity is ...