The optimized component made of glass fiber-reinforced polyamide is represented here within the NX program with a weight-optimized lattice structure. Photo Credit, all images: Naddcon AIM3D GmbH ...

CAMPBELL, Calif.--(BUSINESS WIRE)--Velo3D, Inc. (NYSE: VLD), a leading metal additive manufacturing technology company for mission-critical parts, today announced the latest release of its Flow print ...

The process control and instrumentation minor emphasizes developing skills and knowledge in theory, software and in the field. Students graduate ready to solve complex control problems in the chemical ...

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

The speed of light has come to 3D printing. Northwestern University engineers have developed a new method that uses light to improve 3D printing speed and precision while also, in combination with a ...

Across the semiconductor industry, both FD-SOI and finFET transistor technologies are in high volume production, with IC manufacturers looking to extend both technologies to gain additional ...