BEVERLY, Mass.–Axcelis Technologies Inc. here and Dow Corning Corp. of Midland, Mich., today announced efforts to development a novel process that enables the use of porous ultra-low-k dielectric ...
MIDLAND, Mich. — The Dow Chemical Co. today (March 5) announced it has extended its spin-on SiLK dielectric resin to an ultra-low-k constant value of 2.0 for ICs fabricated with 100-nanometer feature ...
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