Many times, when a component supplier is asked to do an analysis on a failing component, the conclusion is electrical overstress (EOS). Unfortunately, this conclusion does not tell the user much about ...

When designing printed circuit boards (PCBs), keep in mind the major causes of electronic failure: thermal cycling, vibration, and mechanical shock and drop. You can perform a variety of physical ...

As the complexity of printed-circuit assemblies (PCAs) increases, so do the demands placed on failure analysts and analysis labs. The use of BGAs, buried vias, and global component sources challenges ...

Analyzing failures in printed circuit boards (PCBs) is critical to ensure the functionality and reliability of electronic devices. A synopsis of the methods and techniques utilized in PCB failure ...