Hybrid bonding is gaining traction in advanced packaging because it offers the shortest vertical connection between dies of similar or different functionalities, as well as better thermal, electrical ...

Semiconductor manufacturing depends heavily on the ability of machine-vision systems to correctly locate, identify, and align wafers and circuits for testing. Inaccuracy in any of these activities can ...

PI's latest 6-axis alignment system is available in one-sided and double-sided configurations, upright for PIC assembly or inverted, for photonics wafer-probing applications. (Nanowerk News) PI ...

Carbon nanotubes can be five times as energy efficient and five times faster than silicon. engineers at the University of Wisconsin–Madison can align the nanotubes for computer chips by turning them ...

Hybrid bonding has been in production for several years, with mature flows capable of delivering robust yields using 10µm interconnects. At that scale, processes can tolerate hundreds of nanometers of ...

Across the semiconductor industry, ensuring cleanrooms and mini-environments are sufficiently monitored for particle sizes down to 100 nm is a common practice. Most industries have adopted this ...

PI’s latest 6-axis alignment system is available in one-sided and double-sided configurations, upright for PIC assembly or inverted, for photonics wafer-probing applications. PI’s F-713 6-axis ...