SANTA CLARA, Calif.--(BUSINESS WIRE)--3M today announced the initial availability of its high-capacitance Embedded Capacitance Material (ECM) at DesignCon 2012, which allows design engineers a new way ...
Introduced as the company's first venture into the manufacturing of multi-layer ceramic capacitors (MLCCs) in chip form, these new surface-mount caps include both Class 1 NPO and Class 2 X7R devices ...
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