Modern semiconductor manufacturing technology has advanced rapidly. Because of this, measurement using non-contact displacement and transparent coating thickness has become very critical. Applications ...

During the manufacture of semiconductor wafers, thickness measurement forms an important part of this process, since it provides process engineers with the information required to ensure that ...

within-sample variation (for example, position within wafer) sample-to-sample variation within batches of samples (for example, wafer within lot) batch-to-batch variation (for example, across lots) ...

Si LSI manufacturing technology is essential as the foundation of modern society. However, there was no wafer-scale technology for rapid, non-destructive, and non-contact evaluation of the internal ...

a, Schematic illustration of the buried channel transistor structure. b, THz emission from the PN junction. Ultrafast photocarrier transport due to the built-in electric field (drift current) ...