The term "multiphysics" applied to FEA software refers to the simultaneous combination of multiple physical models from different domains — such as fluid, structure, and chemical — to accurately ...

PITTSBURGH, April 24, 2024 /PRNewswire/ -- Ansys (NASDAQ: ANSS) today announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a ...

ANSYS Inc ANSS recently expanded its long-standing collaboration with TSMC to transform the semiconductor industry by leveraging artificial intelligence (AI) to advance multiphysics solutions to ...

FAYETTEVILLE, GA, UNITED STATES, December 31, 2025 /EINPresswire.com/ — Artificial intelligence (AI) is increasingly transforming computational mechanics, yet many AI-driven models remain limited by ...

The stress-from-heat problem involves a tube in a ceramic block. One surface of the block is uniformly heated. A first step of this sequential multiphysics analysis solves for the velocity profile.

3D integrated circuits (3D ICs) are emerging as a revolutionary approach to design, manufacturing and packaging in the semiconductor industry. Offering significant advantages in size, performance, ...

Innovation in semiconductor design today is energized primarily by AI/ML, data centers, autonomous and electric vehicles, 5G/6G, and IoT. Recently developed 2.5 and 3D-IC silicon-based packaging ...

In this Let’s Talk Exascale Podcast, Stuart Slattery and Damien Lebrun-Grandie from ORNL describe how they are readying algorithms for next-generation supercomputers at the Department of Energy. The ...